Skiving Heat Sink

In today’s electronics industry, efficient thermal management is critical for high-performance devices. Skiving heat sink technology has emerged as one of the most effective solutions for dissipating heat in compact and high-power applications. Whether it’s for CPUs, power modules, LEDs, or industrial electronics, a skived fin heat sink ensures that components operate reliably under heavy loads.

A skiving heat sink is a type of heat sink manufactured using the skiving process, where thin fins are sliced directly from a solid metal block. This process allows for extremely high fin density, creating a large surface area that facilitates rapid heat dissipation.

Key features include:

• High thermal efficiency with skived fin design

• Compact footprint for tight electronic layouts

• Superior mechanical strength due to integrated fin-base construction

• Compatibility with heatsink fan systems for active cooling

A skived copper heatsink leverages the high thermal conductivity of copper, making it ideal for applications with demanding heat loads. The copper skiving process allows precise control of fin thickness and spacing, enabling custom designs tailored to specific devices.

Materials and Manufacturing

Skiving heat sinks are typically made from high-quality metals to maximize heat transfer:

• Copper: Produces skived copper heatsink with excellent thermal conductivity. Copper skiving allows thin, high-density fins that quickly transfer heat from the base to the fins.

• Aluminum: Lightweight and cost-effective, suitable for lower-power applications while still achieving excellent heat dissipation.

The heat sink skiving process ensures:

• Uniform fin thickness and spacing

• Maximum surface area for heat transfer

• Strong mechanical integrity without fin detachment

Design Principles

The design of a skived fin heat sink relies on several key principles:

1. Maximized Surface Area: Skived fins are thin and densely packed, allowing more surface area for convective heat transfer.

2. Direct Thermal Path: A solid base ensures minimal thermal resistance between the heat source and the fins.

3. Optimized Airflow: The fins can be aligned to work with natural convection or forced airflow using a heatsink fan.

4. Customizable Geometry: Custom heatsink options allow fin height, spacing, and orientation to be adjusted for specific thermal requirements.

The combination of skived fin technology and high-quality materials ensures optimal performance even in high-density electronic environments.

Typical Specifications

Advantages of Skiving Heat Sink Technology

Choosing a skived heatsink offers several advantages:

• High-efficiency heat dissipation due to skived fin design

• Compact design suitable for modern electronics

• Enhanced mechanical durability

• Ability to integrate with heatsink fan for active cooling

• Supports custom heatsink designs for unique thermal challenges

Professional heat sink manufacturers often provide design and engineering support to optimize skiving heat sink performance for specific applications, ensuring both cost-effectiveness and thermal reliability.

Thermal Resistance Example

Thermal resistance (Rth) is critical for designing skived heatsink solutions. It can be calculated as:

$${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">h</span>}\mathrm{<span\; style="font-size:\; 16px;">s</span>}}<span\; style="font-size:\; 16px;">=</span>\frac{{\mathrm{<span\; style="font-size:\; 16px;">T</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">j</span>}}<span\; style="font-size:\; 16px;">-</span>{\mathrm{<span\; style="font-size:\; 16px;">T</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">A</span>}\mathrm{<span\; style="font-size:\; 16px;">M</span>}\mathrm{<span\; style="font-size:\; 16px;">B</span>}}}{\mathrm{<span\; style="font-size:\; 16px;">P</span>}}<span\; style="font-size:\; 16px;">-</span>{\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">t</span>}\mathrm{<span\; style="font-size:\; 16px;">h</span>}<span\; style="font-size:\; 16px;">-</span>\mathrm{<span\; style="font-size:\; 16px;">j</span>}\mathrm{<span\; style="font-size:\; 16px;">c</span>}}<span\; style="font-size:\; 16px;">-</span>{\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">i</span>}\mathrm{<span\; style="font-size:\; 16px;">n</span>}\mathrm{<span\; style="font-size:\; 16px;">t</span>}\mathrm{<span\; style="font-size:\; 16px;">e</span>}\mathrm{<span\; style="font-size:\; 16px;">r</span>}\mathrm{<span\; style="font-size:\; 16px;">f</span>}\mathrm{<span\; style="font-size:\; 16px;">a</span>}\mathrm{<span\; style="font-size:\; 16px;">c</span>}\mathrm{<span\; style="font-size:\; 16px;">e</span>}}$$R_{hs} = \frac{T_j - T_{AMB}}{P} - R_{th-jc} - R_{interface}Rhs=PTj−TAMB−Rth−jc−Rinterface

Where:

• ${\mathrm{<span\; style="font-size:\; 16px;">T</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">j</span>}}$T_jTj = Junction temperature

• ${\mathrm{<span\; style="font-size:\; 16px;">T</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">A</span>}\mathrm{<span\; style="font-size:\; 16px;">M</span>}\mathrm{<span\; style="font-size:\; 16px;">B</span>}}$T_{AMB}TAMB = Ambient temperature

• $\mathrm{<span\; style="font-size:\; 16px;">P</span>}$PP = Power dissipation (W)

• ${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">t</span>}\mathrm{<span\; style="font-size:\; 16px;">h</span>}<span\; style="font-size:\; 16px;">-</span>\mathrm{<span\; style="font-size:\; 16px;">j</span>}\mathrm{<span\; style="font-size:\; 16px;">c</span>}}$R_{th-jc}Rth−jc = Junction-to-case thermal resistance

• ${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">i</span>}\mathrm{<span\; style="font-size:\; 16px;">n</span>}\mathrm{<span\; style="font-size:\; 16px;">t</span>}\mathrm{<span\; style="font-size:\; 16px;">e</span>}\mathrm{<span\; style="font-size:\; 16px;">r</span>}\mathrm{<span\; style="font-size:\; 16px;">f</span>}\mathrm{<span\; style="font-size:\; 16px;">a</span>}\mathrm{<span\; style="font-size:\; 16px;">c</span>}\mathrm{<span\; style="font-size:\; 16px;">e</span>}}$R_{interface}Rinterface = Thermal interface material resistance

Example: A CPU generating 100 W with ${\mathrm{<span\; style="font-size:\; 16px;">T</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">j</span>}}<span\; style="font-size:\; 16px;">=</span>{\mathrm{<span\; style="font-size:\; 16px;">85</span>}}^{<span\; style="font-size:\; 16px;">\circ </span>}\mathrm{<span\; style="font-size:\; 16px;">C</span>}$T_j = 85^\circ CTj=85∘C and ${\mathrm{<span\; style="font-size:\; 16px;">T</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">A</span>}\mathrm{<span\; style="font-size:\; 16px;">M</span>}\mathrm{<span\; style="font-size:\; 16px;">B</span>}}<span\; style="font-size:\; 16px;">=</span>{\mathrm{<span\; style="font-size:\; 16px;">25</span>}}^{<span\; style="font-size:\; 16px;">\circ </span>}\mathrm{<span\; style="font-size:\; 16px;">C</span>}$T_{AMB} = 25^\circ CTAMB=25∘C, ${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">t</span>}\mathrm{<span\; style="font-size:\; 16px;">h</span>}<span\; style="font-size:\; 16px;">-</span>\mathrm{<span\; style="font-size:\; 16px;">j</span>}\mathrm{<span\; style="font-size:\; 16px;">c</span>}}<span\; style="font-size:\; 16px;">=</span>{\mathrm{<span\; style="font-size:\; 16px;">0.2</span>}}^{<span\; style="font-size:\; 16px;">\circ </span>}\mathrm{<span\; style="font-size:\; 16px;">C</span>}\mathrm{<span\; style="font-size:\; 16px;">/</span>}\mathrm{<span\; style="font-size:\; 16px;">W</span>}$R_{th-jc} = 0.2^\circ C/WRth−jc=0.2∘C/W, and thermal interface ${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">i</span>}\mathrm{<span\; style="font-size:\; 16px;">n</span>}\mathrm{<span\; style="font-size:\; 16px;">t</span>}\mathrm{<span\; style="font-size:\; 16px;">e</span>}\mathrm{<span\; style="font-size:\; 16px;">r</span>}\mathrm{<span\; style="font-size:\; 16px;">f</span>}\mathrm{<span\; style="font-size:\; 16px;">a</span>}\mathrm{<span\; style="font-size:\; 16px;">c</span>}\mathrm{<span\; style="font-size:\; 16px;">e</span>}}<span\; style="font-size:\; 16px;">=</span>{\mathrm{<span\; style="font-size:\; 16px;">0.1</span>}}^{<span\; style="font-size:\; 16px;">\circ </span>}\mathrm{<span\; style="font-size:\; 16px;">C</span>}\mathrm{<span\; style="font-size:\; 16px;">/</span>}\mathrm{<span\; style="font-size:\; 16px;">W</span>}$R_{interface} = 0.1^\circ C/WRinterface=0.1∘C/W:

$${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">h</span>}\mathrm{<span\; style="font-size:\; 16px;">s</span>}}<span\; style="font-size:\; 16px;">=</span>\frac{\mathrm{<span\; style="font-size:\; 16px;">85</span>}<span\; style="font-size:\; 16px;">-</span>\mathrm{<span\; style="font-size:\; 16px;">25</span>}}{\mathrm{<span\; style="font-size:\; 16px;">100</span>}}<span\; style="font-size:\; 16px;">-</span>\mathrm{<span\; style="font-size:\; 16px;">0.2</span>}<span\; style="font-size:\; 16px;">-</span>\mathrm{<span\; style="font-size:\; 16px;">0.1</span>}<span\; style="font-size:\; 16px;">=</span>{\mathrm{<span\; style="font-size:\; 16px;">0.4</span>}}^{<span\; style="font-size:\; 16px;">\circ </span>}\mathrm{<span\; style="font-size:\; 16px;">C</span>}\mathrm{<span\; style="font-size:\; 16px;">/</span>}\mathrm{<span\; style="font-size:\; 16px;">W</span>}$$R_{hs} = \frac{85-25}{100} - 0.2 - 0.1 = 0.4^\circ C/WRhs=10085−25−0.2−0.1=0.4∘C/W

This value informs the skived heat sink design to ensure safe operating temperatures.

Applications

Skiving heat sinks are ideal for:

• CPU and GPU cooling in high-performance computing

• Power electronics like inverters, amplifiers, and motor drivers

• LED modules and high-power lighting systems

• Industrial electronics and telecom equipment

• Custom electronics where layout requires custom heatsink solutions

FAQ – Skiving Heat Sink

1. What is a heat sink?

A heat sink is a device designed to dissipate heat from electronic components, maintaining safe operating temperatures and improving reliability.

2. How does a skiving heat sink work?

It uses heat sink skiving to create skived fin heat sink structures. Heat from the component is conducted to the fins, which dissipate it via convection or forced airflow.

3. What is the difference between a skived heatsink and an extruded heatsink?

Skived heatsinks have thin, densely packed fins for superior thermal performance, while extruded heat sinks typically have thicker, less dense fins.

4. What materials are used for skived heat sinks?

Copper and aluminum. Skived copper heatsink offers high thermal conductivity, while aluminum is lightweight and cost-effective.

5. Can I get a custom heatsink design?

Yes, custom heatsink designs can adjust fin height, spacing, base thickness, and material to meet specific thermal requirements.

6. What are common applications?

High-performance CPUs, GPUs, LED modules, power electronics, industrial and telecom equipment.

7. Can a skived heat sink be used with a heatsink fan?

Yes, combining with a heatsink fan enhances active cooling and reduces thermal resistance.

8. How does copper skiving improve performance?

Copper skiving allows thinner fins and denser arrays, increasing surface area for better heat dissipation.

9. What is heat sink skiving?

It is the process of slicing thin fins from a solid metal block to create skived fin heat sink designs with high thermal efficiency.

10. How is thermal resistance calculated?

Thermal resistance ${\mathrm{<span\; style="font-size:\; 16px;">R</span>}}_{\mathrm{<span\; style="font-size:\; 16px;">h</span>}\mathrm{<span\; style="font-size:\; 16px;">s</span>}}$R_{hs}Rhs = (Junction temp – Ambient temp)/Power – Junction-to-case resistance – Interface resistance. See example in the thermal resistance section.