Epoxy Resin Filling Liquid Cold Plate

Epoxy Resin Filling Liquid Cold Plate is a highly efficient heat dissipation component designed for applications that require precise temperature control and efficient heat dissipation. By filling epoxy resin material between metal plates (such as aluminum) and copper pipes, the heat conduction path is optimized, thermal resistance is reduced, and heat dissipation efficiency is improved. This structure can significantly enhance thermal management capabilities, making it an important heat dissipation solution for industries such as medical equipment, power electronics, data centers, aerospace, and new energy.

Working Principle

The core heat dissipation mechanism of Epoxy Resin Filling Liquid Cold Plate is based on the circulation of coolant. The coolant flows in the copper or aluminum tube, absorbs the heat generated by the electronic equipment when it is working, and releases the heat to the external environment through the radiator or cooling system. The epoxy resin filling layer further optimizes the heat transfer path, reduces the contact thermal resistance, and greatly improves the cooling efficiency.

Product Features

Efficient heat conduction: The epoxy resin filling layer effectively fills the gap between the metal pipe and the plate body, reduces thermal resistance, improves the overall thermal conductivity, and enables heat to be quickly transferred from the heat-generating components to the coolant.

Compact structure: Compared with traditional water-cooled plates, the epoxy resin filling design reduces the air gap, improves the heat conduction efficiency, and makes the overall structure more compact, which is suitable for space-constrained equipment.

Excellent corrosion resistance: The aluminum alloy plate body, brass pipe and high-performance epoxy resin filling material have excellent anti-oxidation and corrosion resistance, and are suitable for high humidity and high temperature environments.

Uniform heat dissipation: By reasonably designing the pipe structure (straight pipe, U-shaped pipe, winding pipe, etc.), the coolant can flow evenly, reduce hot spots, and improve the uniformity of heat dissipation.

Long life and low maintenance: The coolant channel is reasonably designed and easy to clean and maintain; the epoxy resin filling layer provides additional protection, reduces material aging, and increases the service life of the cold plate.

Main advantages

Improve heat dissipation efficiency: Optimize the pipe layout and filling technology to transfer heat to the cooling system faster, improve heat dissipation capacity, and adapt to high power density applications.

Reduce energy consumption: An efficient thermal management system reduces power consumption loss caused by overheating of the equipment and improves overall energy efficiency, especially for data centers and new energy equipment.

Strong adaptability: The size, pipe shape, and filling material can be customized according to specific needs to meet the heat dissipation needs of various equipment, such as medical equipment, industrial equipment, high-performance computers, etc.

Improve equipment reliability: More precise temperature control can prevent electronic equipment from experiencing performance degradation, failure or damage due to overheating, ensuring long-term stable operation of the equipment.

Environmentally friendly materials: The epoxy resin filling layer uses environmentally friendly thermal conductive materials, which meets international environmental standards and reduces the impact on the environment.

Epoxy Resin Filling Liquid Cold Plate is suitable for a variety of fields with high heat dissipation requirements, including but not limited to:

1. Medical industry

CT scanners, MRI (magnetic resonance imaging) equipment: These medical devices generate a lot of heat during operation. liquid cooling plates can ensure precise temperature control to avoid temperature fluctuations affecting imaging quality and equipment life.

Laser treatment equipment: Lasers need to operate at a stable temperature. Liquid cooling plates can provide efficient heat dissipation to ensure that treatment equipment continues to work stably.

High-end experimental instruments: Such as biological analysis equipment, PCR amplification instruments, etc., have strict requirements on temperature control. Liquid cooling plates can effectively manage heat and ensure experimental accuracy.

2. Power electronics

Frequency converters and inverters: These devices generate a lot of heat during power conversion. Liquid cooling plates can prevent overheating, improve energy efficiency, and extend equipment life.

IGBT (insulated gate bipolar transistor) modules: Widely used in electric vehicles, wind power generation and rail transportation, liquid cooling plates ensure that they maintain a stable temperature under high power operation.

High-power LED lighting: In high-power LED systems such as stage lighting and industrial lighting, liquid cooling plates can effectively improve heat dissipation capacity and extend LED life.

3. Data centers and high-performance computing

Servers, GPU computing clusters: High-density computing equipment requires efficient heat dissipation solutions. Liquid cooling plates can reduce server temperature, improve computing efficiency, and reduce energy consumption of cooling systems.

Artificial intelligence training equipment: The GPU of AI computing nodes generates a lot of heat during operation. Liquid cooling plates can accurately control the temperature to prevent heat accumulation from affecting computing speed.

Supercomputing center: In high-performance computer (HPC) systems, liquid cooling plates help manage the heat of a large number of computing cores and maintain long-term stable operation.

4. Aerospace

Satellite electronic equipment: When working in extreme environments, liquid cooling plates can ensure the thermal stability of electronic components and improve equipment reliability.

Aircraft electronic systems: Avionics equipment (such as radars and communication systems) require efficient heat dissipation to adapt to high temperature and high humidity environments. Liquid cooling plates provide ideal heat dissipation solutions.

5. New Energy Industry

Electric Vehicle (EV) Battery Cooling: Liquid cooling plates can be used in battery management systems (BMS) to ensure that battery packs operate at optimal temperatures, improving battery life and safety.

Hydrogen Fuel Cell Cooling: Liquid cooling plates can help manage the heat generated by chemical reactions in hydrogen fuel cell systems, improving energy efficiency and safety.

Epoxy Resin Filling Liquid Cold Plate has become an ideal heat dissipation solution for high-end equipment in various industries with its excellent thermal management performance, efficient heat dissipation, compact structure and wide applicability. Its optimized thermal conduction design, low maintenance cost and customization capabilities make it play an important role in medical, electronics, data centers, aerospace and new energy fields. In the future, with the popularization of high-power density electronic devices, liquid cooling technology will develop further, and Epoxy Resin Filling Liquid Cold Plate will also become a key thermal management component to help equipment achieve more efficient and stable operation.