Bonded Fin Heat Sink Parts

Bonded Fin Heat Sink Parts are manufactured using processes such as pressing, brazing, and thermal conductive adhesive bonding. They increase the heat dissipation surface area by combining the fins with the base to form a structure, and have efficient heat dissipation effects. They are mainly used in industries such as LED lighting, communication base stations, and new energy vehicles. By increasing the heat dissipation area and optimizing heat conduction, Bonded Fin heat sink Parts can ensure stable operation of high-load equipment and prevent performance degradation or failure due to overheating.

Main production process

Pressing process: Use high-voltage equipment to press the fins onto the base to ensure a tight fit and increase heat dissipation efficiency. This process is suitable for applications with medium heat dissipation requirements.

Brazing process: Brazing the fins and the base together at high temperature to provide higher strength and thermal conductivity, suitable for high-power equipment.

Thermal conductive adhesive bonding process: Use thermal conductive adhesive to fix the fins to the base, which is suitable for light load and low-power equipment and has a certain degree of flexibility.

Plug-in process: Punch holes in the base, insert the fins and fix them, suitable for application scenarios that require customized design and flexible layout.

The most commonly used materials

Aluminum alloy (such as 6061, 6063): commonly used for fin materials, with excellent thermal conductivity and machinability.

Copper: higher thermal conductivity, but higher cost, usually used in high-performance applications.

Steel: used for structural parts with special requirements.

Thermal conductive materials: can improve heat dissipation performance, combined with thermal conductive paste or thermal conductive glue to improve the thermal conductivity of the contact surface.

Bonded Fin Heat Sink Parts Production Details

Thickness: Generally between 0.2mm ~ 1mm, depending on the application requirements.

Spacing: 2mm ~ 10mm to ensure smooth airflow. Depending on the application, the fin spacing affects the overall heat dissipation efficiency.

Height: Can range from 10mm ~200mm, depending on the heat dissipation requirements and space constraints. Taller fins can provide more heat dissipation area, but may also affect the smooth airflow.

Bonding method:

Brazing or thermally conductive adhesive bonding: Durability in high temperature environments needs to be considered.

Pressing: The fins and base are required to fit tightly without air gaps.

Substrate thickness: 1mm ~5mm. The thicker the substrate, the more stable the structure, but it will increase thermal resistance.

Heat treatment: Bonded Fin Heat Sink Parts are heat treated (such as T6) to improve strength and durability.

Surface treatment:

Anodizing: A common treatment for aluminum parts that enhances corrosion resistance and wear resistance while improving heat dissipation.

Coating treatment: Special coating can be used to improve the protection performance or thermal conductivity.

Processing accuracy:

The bonding surface of the fin and the substrate needs to maintain a high degree of flatness and finish to reduce the contact thermal resistance. The tolerance is usually controlled within ±0.05mm.

Dimensions and specifications of Bonded Fin Heat Sink Parts

Customized size: Kingka supports customization according to drawings and production as needed. A variety of size options can be provided, such as the length, width, thickness of the fin, the size of the substrate, etc., to meet the space requirements of different devices.

Strict testing standards

Heat dissipation performance test: Use a simulated environment to test the heat dissipation effect to ensure that the operating temperature of the target device can be effectively reduced.

Structural strength test: Ensure that the bonding strength of the fin and the substrate meets the requirements.

Durability test: Test the stability in harsh environments such as high temperature and humidity.

Bonded Heat Sinks

Bonded Heat Sinks are high-efficiency heat sinks with fins bonded, brazed or pressed together to the base, which can quickly dissipate heat. They are most commonly used in electronic devices such as central processing units (CPUs), graphics processing units (GPUs), power modules, IGBT modules and inverters. Bonded Heat Sinks use a combination of copper base and aluminum fins to provide excellent thermal conductivity and ensure stable operation under high-power working conditions.

Bonded Fin Heat Sink

Bonded Fin Heat Sink can effectively dissipate the heat generated during operation. In high-power LED drivers and industrial lighting, Bonded Fin Heat Sink can maintain the stability of the equipment, prevent overheating, and extend the service life.

FAQ

What are the main advantages of Bonded Fin Heat Sink?

The main advantages include high thermal conductivity, flexible design, light weight and superior heat dissipation performance.

What are the application scenarios for Bonded Fin Heat Sink?

Suitable for high-heat electronic devices such as CPU, GPU, power module, IGBT module, inverter and LED lighting.

How to ensure the quality of the heat sink?

The heat sink will undergo strict quality control during the production process to ensure compliance with international standards.

Can it be customized?

Yes, Bonded Fin Heat Sink can be customized according to customer drawings and needs.

What are the maintenance and cleaning requirements?

Regularly check and clean the surface of the heat sink to ensure heat dissipation efficiency and avoid dust accumulation that affects heat dissipation performance.

How long is the service life?

With proper use and maintenance, Bonded Fin Heat Sink usually has a long service life.

How to choose a suitable heat sink?

Factors such as the power, working environment, heat dissipation requirements and material properties of the equipment should be considered when choosing.

Is there a sample available?

Yes. KingKa supports free proofing, welcome to contact us!